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Mechatronics

Vacuum reflow soldering system
(for mass production)

Model: MP2

A mass-production unit with two-chambered specifications, allowing for separate cooling and heating.
Processing space: 380 mm (W) x 310 mm (D) x 100 mm (H); can handle the mounting of even large pieces of work.

Merits

Usage

Power modules and other devices
LED
Wafer bump(Bump forming)
FCB

Documentation

Check the documentation below for detailed specifications.

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